積層陶瓷電容製程與材料開發

積層陶瓷電容(MLCC)是現代3C產業不可或缺的電子元件，利用材料的開發，可以在更小的體積、以更多的層數獲得更高的電容。

Materials and Process Design for MLCC

Multi-Layer Ceramic Capacitor (MLCC) is a critical component in 3C electronic products. New materials design makes higher electric capacity possible in a smaller dimension through stacking higher number of ceramic layers.

Contact Center of EMO Materials and Nanotechnology for details.

巨孔微米球

具有良好球體與均勻性的巨孔微米球，得以應用在諸多化學、生醫藥物釋放、能源等領域，台北科大研發團隊獲得多項技術突破與獎項。

Gigaporous Microspheres

Gigaporous microspheres Taipei Tech developed demonstrate uniform and excellent sphericity making them applicalbe for chemical, bio-medical, energy applications, etc. Our research team has gained numerous technical improvement and awards.

Contact Nano-Energy Materials Lab for details.

無機聚合技術

無機聚合技術係利用鹼性配方液溶出礦物或廢棄物表面之矽、鋁離子，經聚合、脫水、硬化後形成Si-O-Al短程有序之三維結構。具減碳效益、防火隔熱、重金屬穩定化等特性，應用層面廣泛。

Geopolymeric Technology

Geopolymeric technology uses alkali solution to dissolve Si, Al ions to form a 3D framework. It reduces CO₂ emission and offers superior fire resistance and mechanical properties for engineering applications.

Contact Mineral Processing Lab for details.

金屬積層製造及粉末相關製程

包含模具鋼、鎳合金、鈦合金之積層製造實心與多孔材特性研究。應用場域包括生醫、航太、模具等。專精於金屬粉末及其特殊製程開發。

Additive Manufacturing (AM) of Metals

Focusing on PBF and DMLS processes for various alloys. We specialize in mechanical and fatigue properties of metals made by AM for bio-medical and aerospace fields.

Contact Applied Metals Processing Lab / Powder Metallurgy and Sintering Lab for details.